A recently added report by Persistence
Market Research (PMI), titled, “Global Market Study on
Semiconductor Assembly and Testing Services (SATS): To be Driven by
Increasing Demand for High-End Packaging Solutions,” throws light
on important aspects of the market. It offers information on the
various growth drivers and restraints molding the growth path of the
market, its size, and prospects going forward. It carefully examines
the competitive dynamics in the market as well by leveraging
different popular analytical tools.
The global semiconductor industry is
extremely volatile in nature, in which the prominent companies are
fabless firms that focus on designing better products and use their
resources to improve performance of the chipsets or ICs. Hence, most
of the services pertaining to assembly, testing, and packaging of
semiconductors are outsourced by fabless companies to third parties
called outsourced semiconductor assembly and test services (SATS).
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Another reason explaining the adoption of
semiconductor assembly and testing services (SATS) is the switch of
semiconductor processing technology to the larger wafers and reduced
feature sizes, which has upped expenditure since it requires building
an ultra-modern wafer fabrication factory equipped with cutting-edge
machines. High capital expenditure required in wafer fabrication and
its packaging and testing has compelled semiconductor companies to
outsource work to SATs so that they are able to devote more time to
their core business.
Such growth drivers are expected to bring
about a CAGR of 4.7% from 2015 to 2021 in the global semiconductor
assembly and testing services (SATS) market. Rising at this rate, the
market which was valued at US$28.18 bn in 2014, is predicted to reach
a value of US$39.05 bn by 2021.
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Majorly fuelling the market is the
soaring popularity and sales of consumer electronics products such as
tablet PCs, wearable devices, namely smart glasses and watches, head
mounted displays, fitness equipment, etc., audio and video devices,
gaming consoles, and surging popularity of smartphones. In addition,
evermore technologically advanced next-generation cars powered with
better car safety and management systems, are also proving beneficial
to the semiconductor assembly and testing services (SATS) market.
By packaging solutions, the global
semiconductor assembly and testing services (SATS) market can be
divided into copper/gold wire bonding, flip chip, copper clip, wafer
level packaging, and 3D TSV. Among them, the wafer level packages and
flip chip are driving growth in the market.
In terms of application, the main
segments of the global semiconductor assembly and testing services
(SATS) market are communication, consumer electronics, computing and
networking, automotive electronics, and electrical. In 2014, the
consumer electronics application segment was valued at US$3.74 bn.
Geographically, the key segments of the
global semiconductor assembly and testing services market (SAPS) are
North America, Latin America, Taiwan, Europe, and the Middle East and
Africa.
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Some of the prominent names in global
semiconductor assembly and testing services (SAPS) market are ASE
Group, Global Foundries, Amkor Technologies Inc., Silicon Precision
Industries Co. Ltd., Powertech Technology Inc., STATS ChipPAC Ltd.
(JCET), Psi Technologies Inc. (IMI), CORWIL Technology corporation,
and Chipbond Technology Corporation.
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